Service

(1) Mainly produce two specifications of polycrystalline silicon chips used in solar energy cells:125X125mm, 156X156mm.

(2) Processing of monocrystalline and multicrystalline ingots to wafer as well as growing of multicrystalline ingots(240-271Kg)is also possible depending on free capacities.

(3) The products were manufactured by the solar energy level silicon raw materials, the advanced vertical gradient coagulation technology and wire slicing technology, thus guaranteed the crystal orientation and the crystallization velocity effectively which can eventually insure the stability and high conversion rate of solar energy polycrystalline silicon chips.

(4) We possesses independent innovation crafts in aspects of crystal growth control and annealing.

Crystallization

Crystal Growing ·Equipment：Feedstock Etching Line ·Silicon material which is not pre-washed can be cleaned and prepared for further processing. The following materials With(99.9999 % purity) can be used to grow multi-crystalline ingots for Solar applications: ·Poly-silicon Chunks or Granular ·Carbon Ends from Poly-silicon production process ·Tops & tails from CZ production of semiconductor wafer producers ·Pot Scrap from CZ production of semiconductor wafer producers ·Broken Wafers from the production of semiconductor wafers

Crystallization ·equipment：DSS furnace provided by GT-Solar, USA 　　The company installed in the first phase 4 DSS Furnaces delivered by GT-Solar, USA. The DSS Furnace can grow -ingots with a typical weight of 240-270 kg. The size of the ingot is 690 x 690 x 220 mm and the cycle time is about 46 hrs. By the year 2007 16 more Furnaces will be added to enable the company to produce 50 MW of Wafers for the Solar Industry.

Wafer production

Band sawing ·Equipment: Merer Brger BS 801 band saw, Switzerland 　　The company installed a Meyer+Burger BS 801 Band Saw for cutting the 240 kg ingots into blocks. With one BS 801 it is possible to cut one ingot into blocks in about 6-7 hrs. Thus it is possible to serve 3-4 Wire Saws with only one Band Saw.

Infrared testing for Inclusions and micro crystals before wire sawing ·equipment：Infrared testing facility 　rigid testing to ensure excellent quality.

Wire sawing ·Equipment：Merer Brger DS 262/C band saw, Switzerland 　　The multi-crystalline blocks will be glued to a workpiece holder and then processed through the DS 262/C Wire Saw.

Wafer cleaning ·Equipment: GTS Wafer cleaning line 　　The Wafer Cleaning Line can handle all kinds of wafers from 103x103 to 156x156 mm. The semiautomatic cleaning line has a capacity of about 1,200 wafers per hour and can be also adapted to different types of wire saw cutting slurries.

Testing

The company is testing its products during the whole production process.

Testing items	Testing standard	Testing content
Conductivity	P-Type, N-Type	Feedstock
	P-Type	Ingots, Blocks, Wafers
Resistivity	0.8 - 3Ωcm	Ingots, Blocks, Wafers
Minority carrier lifetime	> 2μs	Ingots, Blocks, Wafers
Dimensions	Thickness, TTV	Blocks, Wafers
Infrared Testing	for Inclusions	Mimicrystals in the block before wire sawing

products

Wafer Specification
Parameter	Wafers
General
Crystal type	Multicrystalline
Dopant	Boron
Electrical characteristics
Resistivity	0.8~ 3.0Ωcm (average 1.5Ωcm)
Minority carrier lifetime	> 2μs
Conductivity	P-Type
Chemical characteristics
Carbon content	< 2 x1018cm-3
Oxygen content	< 4 x 1017cm-3
Dimensions
Wafer square side	156 x 156±0.5 mm
	125 x 125±0.5 mm
Wafer thickness	240μm±30μm
TTV:	≤50μm
Bow:	≤60μm
Saw marks:	≤20μm
Edge defect	none
Wafer surface	as cut and cleaned
Contamination	no dirt / oil stains, remains of soap / glue No fingerprints etc.